About the product
- Includes 100pcs copper pad shim with 10 gram thermal conductive glue, low profile 15mm x 15mm / 0.6 x 0.6 inches, in 12 thicknesses.
- Includes 12pcs of these thicknesses: 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm.
- Includes 5pcs of these thicknesses: 0.8mm, 1mm, 1.2mm, 1.5mm, 1.8mm.
- Includes 3pcs 2mm.
- [Main Body Material: Copper C1100]. Excellent Thermal conductivity: 401W/mK; can be applied for gap filler in cooling of PC components Development Boards Laptop GPU VGA VRAM RAM IC Chips PS5 M.2 NVMe SSD, etc
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