About the product
- Do Not Use Thermal Glue Between CPU Chip And Heat Sink, use it within 24 hours once opened.
- Thermal conductivity:> 1.2W/m-K
- Strength of connected buildings: 55 lb.
- Features: thermal properties, strong adhesion
- Application: apply to all heatsink no fixed clip thermal paste. Ideal for MOSFET HeatsinkA
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