About the product
- Upgraded Model, we have upgraded the product and changed the material from aluminum to pure copper. And the back adopts a full-bump design, which greatly increases the heat exchange area.
- And retains the thermal double-sided adhesive on the back for easy installation.
- Product material: pure copper. (Also called red copper, with a copper content of about 99.6%, it is widely used in electrical and electrical fields as electrical and thermal conductive materials.)
- It is suitable for PC memory module cooling.
- Pack of 2That is your order Qty "1", the package contains two memory heat sinks.
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