About the product
- PLEASE NOTE: Due to the extremely low hardness; the installation of the 0.5 mm pad requires extra care; Please refer to the user manual
- MINIMIZATION OF THERMAL RESISTANCE: The thinner the pad, the lower the thermal resistance; Thanks to its good compression properties, the very soft heat conduction pad is particularly a good heat conductor
- HIGH PERFORMANCE: Based on silicone and a special filler, TP-3 also outperforms high-performance pads, especially when height differences of closely spaced chips
- VERSATILE APPLICATIONS: Heat-conducting, vibration-damping, mouldable, electrically insulating - can be easily cut to size; Ideal for RAM, chipset, IC in PC, laptop, console, graphic cards
- SAFE HANDLING: The pad contains no metal particles, is electrically insulating and non-capacitive; Handling is therefore safe, as contact with electrical parts will not cause damage
- BRIDGING GAPS: The TP-3 are softer than conventional pads and therefore particularly suitable for different heights and possible tolerances, without stressing sensitive components
- TECHNICAL DATA: Quantity: Pack of 2, Size: 200 x 100 x 0.5 mm, Hardness: 55 Shore 00, Operating temperature: -40~150
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