About the product
- Made of high quality Aluminum, good thermal conductivity
- Reduce the risk of hardware failure due to overheating
- Maximize surface area Designed in contact with the cooling air. The 26 pcs fins increase the area of the board and thus provide for greater heat transfer
- Widely use for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc.
- Size: 5.9"(L) x 3"(W) x 1.1"(H) /150mm(L)x 80mm(W) x 27mm(H). Please make sure that the size of the heat sink fits that of your component
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