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Thermal Pad 3.5 W/Mk, 298X298X1.0Mm, Tg-A3500 Ultra Soft Gap Filler, Heat Sink Cooling Pad, For Pc Laptop/Gpu/Cpu, Natural Tack

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AED 282 AED 212
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About the product

  • Good Thermal Conductivity Ability - Using the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material.
  • High Compressibility and Compliance - Adequately fill the voids of the contact surface.
  • Natural Tack - The assembly components are not easily shaken.
  • Safe and easy to use - You can choose a suitable thickness of thermal pad according to the gap between the heating source and the heat sink. It can be cut to size and easy to install, replacing the traditional thermal paste.
  • Application - Thermal pad with good thermal conductivity, often used in the middle gap of battery modules.

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